52 SMT Magazine • January 2017
Living Up to Their Name at Alpha
Assembly Solutions
At SMTAI in October, I-Connect007's Judy War-
ner spent some quality time with Alpha Assembly
Solutions' Jason Fullerton, to discuss Alpha's in-
novative new products. Fullerton also discussed a
paper he was presenting, which compares two
lead-free, silver-free alloys in a selective soldering
application.
Digi ConnectCore 6UL Creates a
Big Buzz at electronica
Guy Volckaerts, director for EMEA embedded sales
at Digi, speaks with I-Connect007's Judy Warner
about Digi's star-of-the-show at the recent elec-
tronica event in Germany—the Digi ConnectCore
6UL—a quick, simple, feature-rich, yet very flexi-
ble system-on-module solution for OEMS and de-
velopers.
KIC Shows Solutions to Voiding Problems
via Optimized Reflow Profiling
At the recent SMTAI event, MB (Marybeth) Allen
of KIC speaks with I-Connect007's Patty Goldman
about her company, and discusses some of the de-
tails of her presentation titled "Optimized Reflow
Profiling to Minimize Voiding".
Electrolube Contact Lubricants Extend
Switch Lifetime
Electrolube's Contact lubricants have been proven
to extend the lifetime of switches by more than
300%, increasing performance in a variety of ap-
plications and preventing the need for expensive
maintenance.
Molex Solder on Polyester Substrate
Delivers Flexible, Cost-effective Circuitry
Molex has introduced Solder on Polyester Sub-
strate, a flexible, economical alternative to rigid
PCB and polyimide. Surface mount (SMT) com-
ponents, including fine-pitched integrated circuits
(ICs) are attached with low-temperature solder and
encapsulated on a polyester substrate.
Alpha's Mitch Holtzer to Present on
Minimizing Voiding in Bottom Terminated
Components at IPC APEX 2017
Mitch Holtzer, Director of Reclaim for Alpha As-
sembly Solutions, a part of the MacDermid Per-
formance Solutions group of businesses, will pres-
ent the paper titled "Minimizing Voiding in Bot-
tom Terminated Components Using Vacuum As-
sisted Reflow", at IPC APEX EXPO 2017.
SED Systems Chooses ACE Selective
Soldering Equipment Once Again
ACE Production Technologies, Inc., a leading sup-
plier of selective soldering systems, is pleased to
announce that Calian's system engineering divi-
sion, SED Systems has purchased a KISS-102 selec-
tive soldering machine from ACE.
Super Dry Launches Series of
Expandable Desiccant Cabinets
Moisture specialist Super Dry has launched a new
series of desiccant storage solutions. Comple-
menting the company's extensive range of ultra-
low humidity drying and storage cabinets, the
MSD Series features very high performance dehu-
midification in a modular design that costs 50%
less than conventional solutions.
Indium's Karch Wins Best Presentation
at IMAPS Autumn Conference 2016
Indium Corporation's Andreas Karch, Regional Tech-
nical Manager for Germany, Austria and Switzerland,
was recognized for his technical presentation on new
solder material technology in the manufacturing pro-
cess of IGBT modules, at the recent IMAPS Autumn
Conference in
Munich, Germany. Karch's presentation
featured a new method that produces strong, reliable
solder joints that resist cracking and thermal fatigue.
Goepel Adds Solder Bead Detection
Function in AXI System
The automatic X-ray system X Line·3D from GOE-
PEL electronic now has a new test function for au-
tomated detection of solder beads.
Supply Lines
Highlights