SMT007 Magazine

SMT-Jan2017

Issue link: https://iconnect007.uberflip.com/i/769122

Contents of this Issue

Navigation

Page 3 of 115

4 SMT Magazine • January 2017 This issue of SMT Magazine looks into the impact of plating and surface finishing in PCB assemblies, especially when it comes to solderability and solder joint reliability. Plating and Surface Finishing: Impact on Electronics Assemblies Evaluation of the Use of ENEPIG in Small Solder Joints by Ben Gumpert, William Fox, and C. Don Dupriest Effect of Solder Composition, PCB Surface Finish and Solder Joint Volume on Drop-Shock Reliability by Jim Wilcox, Ph.D., Francis Mutuku, Shuai Shao and Babak Arfaei, Ph.D. Solder Ball Joint Reliability with Electroless Ni/Pd/Au Plating— Influence of Electroless Pd Plating Film Thickness by Yoshinori Ejiri, Takehisa Sakurai, Yoshinori Arayama, Yoshiaki Tsubomatsu, and Kiyoshi Hasegawa Plating and Surface Finish: Assemblers' POV Interview with Joemar D. Apolinario and Dnichols R. Dulang, Integrated Micro-Electronics Inc. 12 30 54 72 January 2017 • Featured Content 12 30 M A G A Z I N E 54 72

Articles in this issue

Archives of this issue

view archives of SMT007 Magazine - SMT-Jan2017