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REGISTER TODAY! Keynote Presentations When Coating Hits the Fan - Consequences of Poor Ruggedization Jason Keeping, P.Eng., Celestica, Inc. Recent Advances and New Trends in Semiconductor Packaging John Lau, Ph.D., ASM Pacific Technology IoT/IoE Cisco Systems Program Sessions » Cleaning of No Clean Flux Residues » Enhancing Assembly and Test Processes » Design and Manufacturing » Advanced Packaging » Inspection and Quality »Paste Printing and Soldering SBL Claimable. If you need payment options other than credit card or check, please contact admin@smtapenang.com.my or call 04-6433817 or H/P: 012-5596836 The conference is "claimable from HRDF under SBL scheme Half-Day Training Workshops WS1 Robust Coating Processes in the Factory: Methods, Critical Parameters, Problems and Remedies Jason Keeping, P.Eng., Celestica, Inc. WS2 Choosing Solders for the New Era Part 1- Low Cost High Reliability Lead-Free Solder Alloys Ning-Cheng Lee, Ph.D., Indium Corporation Fan-Out Wafer-Level Packaging and 3D Packaging John Lau, Ph.D., ASM Pacific Technology WS3 WS4 Choosing Solders for the New Era Part 2- It is Time for Low Temperature: Low Temperature Solders, New Development, and Their Applications Ning-Cheng Lee, Ph.D., Indium Corporation CONTACT Jenny Ng Conference & Education Manager 952-920-7682 jenny@smta.org www.smta.org/southeast-asia Register now and learn about new assembly technology, growing yield and increasing reliability. This global conference is a strong technical three-day event focused on today's most important and timely issues in electronics manufacturing SE ASIA TechNICal ConferencE SEA on Electronics Assembly 2017 March 28-30