PCB007 Magazine

PCB-Feb2017

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4 The PCB Magazine • February 2017 As technology moves increasingly faster, so do our equipment, materials and chemistry suppliers to help us to enable that next greatest invention. Are you ready for the next thing, to keep pushing forward? This month, our contributors shed a little light on that path forward. Meet the future! February 2017 Featured Content New Technologies FEATURE COLUMN: Emerging Technology, Training for the Future, and the Next Industrial Revolution by John Mitchell FEATURES: Vertical Conductive Structures—a New Dimension in High-Density Printed Circuit Interconnect Interview with Joan Tourné Industry 4.0—Inkjet Technology is Changing the World of PCB Manufacturing by Wouter Brok, Klaus Ruhmer and Henk Goossens The Power of Three: A Solder Mask Solution for North America by Dick Crowe Taiyo's John Fix on New Materials, Products in the Works Interview with John Fix Schmoll Talks Technology Interview with Thomas Kunz Inkjet Printing Solder Mask Interview with Frank Louwet and Mariana Van Dam EIPC Workshop on PCB BioMEMS by Alun Morgan 12 16 22 34 36 44 52 60 22 36 44 16 12 34

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