SMT007 Magazine


Issue link:

Contents of this Issue


Page 44 of 83 2017 14 th International Wafer-Level Packaging Conference Contact Jenny Ng 952-920-7682 Call for Participation The International Wafer-Level Packaging Conference Technical Commitee invites you to submit an abstract for presentations, posters and workshops. Abstracts Deadline: April 10, 2017 *Technical papers are required* Submit online Suggested Topics Wafer-Level Packaging 3D Packaging Integration Advanced Integrated Systems and Devices Advanced Wafer-Level Manufacturing and Test October 24-26, 2017 DoubleTree by Hilton San Jose, CA Orgnaized by:

Articles in this issue

Links on this page

Archives of this issue

view archives of SMT007 Magazine - SMT-Mar2017