SMT007 Magazine

SMT-Mar2017

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www.iwlpc.com 2017 14 th International Wafer-Level Packaging Conference Contact Jenny Ng jenny@smta.org 952-920-7682 Call for Participation The International Wafer-Level Packaging Conference Technical Commitee invites you to submit an abstract for presentations, posters and workshops. Abstracts Deadline: April 10, 2017 *Technical papers are required* Submit online www.iwlpc.com Suggested Topics Wafer-Level Packaging 3D Packaging Integration Advanced Integrated Systems and Devices Advanced Wafer-Level Manufacturing and Test October 24-26, 2017 DoubleTree by Hilton San Jose, CA Orgnaized by:

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