PCB007 Magazine

PCB-Apr2017

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April 2017 • The PCB Magazine 11 Todd) describes a system to improve the flow of information that will help ensure correct electrical testing and minimize delays and er- rors. Keith Sellers, NTS−Baltimore, provides a detailed explanation of several thermal shock and cycling test methods which many should find very useful. RBP Chemical's Mike Carano gives us some good basic troubleshooting info on peeling copper circuits. But we're not done, by a good bit. As always, we have a technical paper unrelated to the theme. This one is by Steve Vetter of the Naval Surface Warfare Center in Crane, Indiana (USA) with other authors. The subject is implementing a trust accreditation process for PCB manufac- turers, so this is worth a careful read. To quote a short passage: "…the trust accreditation process will be critical for securing the DoD, PrCB [PCB] industrial base going forward…" Our regular columnist, IPC President John Mitchell, presents three manufacturing policy initiatives for the Trump administration to con- sider to help strengthen manufacturing. And of course, last but not least, the Launch man Barry Cohen gives a primer of best practices for craft- ing worthwhile news releases. Do read these! Next month, we stray from the typically heavy technical content to a personnel subject. One of the things that is almost always brought up in conversations at meetings, over drinks, in interviews, or almost any time, is the "gray- ing" of our industry and what to do about it. So we're calling our May issue "Help Wanted!" and it will focus on the challenges of finding and retaining younger workers that will become the next generation of PCB manufacturing gurus. If you haven't already, subscribe now to get it de- livered to your inbox the moment it's published so you can dig right in. PCB Patricia Goldman is a 30+ year veteran of the PCB industry, with experience in a variety of areas, including R&D of imaging technolo- gies, wet process engineering, and sales and marketing of PWB chem- istry. Active with IPC since 1981, Goldman has chaired numerous committees and served as TAEC chairman, and is also the co- author of numerous technical papers. To contact Goldman, click here. FASTER, FASTER, FASTER… OR THE NEED FOR SPEED, MORE SPEED! Figure 3.

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