74 SMT Magazine • July 2017
RTW NEPCON CHINA: Mycronic Meets High-
volume Demand with Solder Jet Printing
Mycronic VP for Global Dispensing and Managing
Director Clemens Jargon discusses how the flexibil-
ity of solder jet printing helps reduce downtime in
the line, thus increasing total line speed and en-
abling it to keep up with high-volume demand.
Business and Technical Developments
at Super Dry
Totech
At the recent SMT Hybrid Packaging show in
Nuremberg, Germany, I-Connect007 Technical Edi
-
tor Pete Starkey visits Super Dry Totech and spends
a few minutes with CEO Jos Brehler and Sales Man-
ager Terry Morgan to talk about the rationale be-
hind ASYS Group's acquisition of stake in Super Dry
T
otech, as well as the latest technology develop-
ments happening at the company.
Nordson Showcases Test and Inspection
Systems at SEMICON West
Nordson DAGE and Nordson YESTECH, divisions
of Nordson Corporation (NASDAQ: NDSN), an
-
nounce plans to exhibit in Booth #5644 at SEMI-
CON West, scheduled to take place July 11-13,
2017 at
the Moscone Center in San Francisco, Cal-
ifornia.
Lord Adds Ellsworth Adhesives to Its
Electronic Materials Distribution Team
Lord Corp. has announced that Ellsworth Adhesives
will now sell its electronic materials product line.
Zestron Technical
Workshop Tackles
Next Generation of Cleaning
Zestron recently held a technical workshop in Ala
-
bang, Muntinlupa City in the Philippines to help us-
ers address their cleaning challenges amid advance-
ments in semiconductor device packaging.
Electrolube India Awarded
ISO 9001-2015 Certificate
Electrolube India has received one of the world's
most recognized standards, the ISO 9001-2015.
This standard is based upon verification of a num-
ber of quality management principles demonstrat-
ed by an organization. ISO 9001-2015 requires a
strong customer focus and a culture of continual
improvement.
VJ Electronix to Relocate Facility to
Chelmsford, Massachusetts
VJ Electronix Inc. has announced that effective
July 1, the company is moving to a new facility in
Chelmsford, Massachusetts. The new centrally lo-
cated building is approximately 10 miles north of
the existing Littleton facility.
Indium's
Bernard Leavitt to Present
at IMAPS HiTEN 2017
Indium Corporation's Bernard Leavitt, Product Spe
-
cialist, High-Temperature Applications, will present
at IMAPS High Temperature Electronics
Network
2017 (HiTEN 2017), July 10-12 in Cambridge,
United Kingdom.
RTW NEPCON CHINA: Teknek Discusses
Contact Cleaning Technology Trends
Stephen Mitchell, managing director of Teknek, a
contact cleaning solutions provider, discusses the
latest trends in contact cleaning technology. He
provides his outlook on China's electronics man
-
ufacturing industry and intelligent manufacturing,
and talks about how Teknek's contact cleaning sys-
tems are helping customers address their defects
and productivity issues.
Alpha to Highlight New Material Set
Combinations at SMTA Ohio Expo
& Tech
Forum
Alpha Assembly Solutions will feature its new mate-
rial set combinations at the upcoming SMTA Ohio
Expo and Tech Forum to be held on July 13, 2017
at the Embassy Suites Cleveland-Rockside in Inde-
pendence, Ohio.
Supply Lines
Highlights
