SMT007 Magazine

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• Cover
• Featured Content — Assembly Training and Education
• More Content
• Column — Assembly Training and Education
• Column — The Role of Bismuth (Bi) in Electronics: A Prelude
• Short — Soft and Stretchy Fabric-Based Sensors for Wearable Robots
• Feature — Training and Education: Key to Improving Electronics Assembly
• Short — New 3-D Chip Combines Computing and Data Storage
• Column — Analyzing the Cost of Material in Today's Global Economy, Part 3
• Short — I-Connect007 Survey on Process Step Elimination: Cycle Time Spent on Final Inspection
• Feature — Empowering the Workforce Through Training: An Investment Return
• MilAero007 Highlights
• Feature — The EMS Skills Gap Epidemic
• Supply Lines Highlights
• Article — Process Step Elimination: Driven by Cost and Efficiency, Enabled by Process and Materials Innovation
• Short — Acousto-Optic Devices: Finding New Horizons
• Article — Verification of Inspection Results: Local, Central, Global?
• Short — I-Connect007 Survey on Process Step Elimination: What is More Important for Productivity?
• EIN Market Highlights
• Article — Soldering Fumes in Electronics Manufacturing: Damaging Effects and Solutions for Removal
• Interview — Cleaning that Matters
• Career Opportunities Section
• Top Ten Recent Highlights from SMT007
• Events Calendar
• Advertiser Index and Masthead