SMT007 Magazine

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• Cover
• Featured Content — Assemblers' Connection to Design
• More Content
• Column — What Matters Most is Communication
• Feature — Communication Still the Best Tool
• Short — Joining Forces: SMTA and the SMART Group in Europe
• MilAero007 Highlights
• Feature — Three Perspectives on HDI Design and Manufacturing Success
• Short — Research Yields Significant Thermoelectric Performance
• Column — Two Prevalent Rework Heating Methods—Which One is Best?
• Feature — DFx on High-Density Assemblies
• Supply Lines Highlights
• Feature — Dealing with Vias in Pads
• Short — Mentor Eases Programming in Viscom Inspection Systems
• Column — The Proper Position to Take on Voids in Solder Joints, Part 1
• Short — EPTAC Discusses Manufacturing Training Trends
• Feature — Via-in-Pad Plated over Design Considerations to Mitigate Solder Separation Failure
• Short — How Automation and Government Support Can Help Reshoring Drive
• EIN Market Highlights
• Feature Interview — HDI Considerations: Interview with ACDi's Garret Maxson
• Short — I-Connect007 Launches The Printed Circuit Assembler's Guide to…Conformal Coatings for Harsh Environments Micro eBook
• Interview — Optimal Electronics Sets Sight on Growth
• Short — How to Tell if You Need PCB Assembly Services
• Top Ten Recent Highlights from SMT007
• Career Opportunities Section
• Events Calendar
• Advertiser Index and Masthead
• Back Cover