SMT Magazine

SMT-Nov2017

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November 2017 • SMT Magazine 97 Ventec Seeking U.S. Product Manager for tec-speed Want to work for a globally successful and grow- ing company and help drive that success? As a U.S.-based member of the product and sales team, your focus will be on Ventec's signal integrity ma- terials, tec-speed, one of the most comprehensive range of products in high-speed/low-loss PCB ma- terial technology for high reliability and high-speed computing and storage applications. Combining your strong technical PCB manufacturing and de- sign knowledge with commercial acumen, you will offer North American customers (OEMs, buyers, designers, reliability engineers and the people that liaise directly with the PCB manufacturers) advice and solutions for optimum performance, quality and cost. Skills and abilities required: • Technical background in PCB manufacturing/ design • Solid understanding of signal integrity solutions • Direct sales knowledge and skills • Excellent oral and written communication skills in English • Experience in making compelling presentations to small and large audiences • Proven relationship building skills with partners and virtual teams This is a fantastic opportunity to become part of a leading brand and team, with excellent benefits. Please forward your resume to jpattie@ventec-usa.com and mention "U.S. Sales Manager—tec-speed" in the subject line. www.venteclaminates.com Arlon EMD, located in Rancho Cucamon- ga, California is currently interviewing can- didates for manufacturing and man- agement positions. All interested can- didates should contact Arlon's HR depart- ment at 909-987-9533 or fax resumes to 866-812-5847. Arlon is a major manufacturer of special- ty high performance laminate and prepreg materials for use in a wide variety of PCB (printed circuit board) applications. Arlon specializes in thermoset resin technology including polyimide, high Tg multifunc- tional epoxy, and low loss thermoset lami- nate and prepreg systems. These resin sys- tems are available on a variety of substrates, including woven glass and non-woven ara- mid. Typical applications for these materials include advanced commer cial and military electronics such as avionics, semiconductor testing, heat sink bonding, high density in - terconnect (HDI) and microvia PCBs (i.e., in mobile communication products). Our facility employs state of the art pro- duction equipment engineered to provide cost-effective and flexible manufacturing capacity allowing us to respond quickly to customer requirements while meeting the most stringent quality and tolerance de - mands. Our manufacturing site is ISO 9001: 2008 registered, and through rigorous qual- ity control practices and commitment to continual improvement, we are dedicated to meeting and exceeding our customer's requirements.

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