Issue link: https://iconnect007.uberflip.com/i/911509
4 SMT Magazine • December 2017 The solder paste printing process accounts for al- most 70% of PCB assembly defects. This month's issue of SMT Magazine looks into the critical fac- tors causing these issues, and features strategies, tips and tricks to help assemblers improve the yield and quality in their solder paste printing operation. Solder Paste Printing: Screening Out the Defects Equipment Matters in Solder Paste Printing by Stephen Las Marias Step Stencil Technologies and Their Effect on the SMT Printing Process by Greg Smith, Tony Lentz and Bill Kunkle Tips & Tricks: Generating Stencil Tooling by Ken Horky The Effect of Area Shape and Area Ratio on Solder Paste Printing Performance by Stefan Härter, Jens Niemann Jörg Franke, Friedrich-Alexander, Jeff Schake and Mark Whitmore Solder Printing Process Inputs Impacting Distribution of Paste Volume by Marco Lajoie and Alain Breton Evaluation of Stencil Technology for Miniaturization by Neeta Agarwal, Robert Farrell, Joe Crudele, Chrys Shea, Ray Whittier and Chris Tibbetts 16 28 40 44 62 70 December 2017 • Featured Content M A G A Z I N E 28 40 62 70 44 16