SMT Magazine

SMT-Dec2017

Issue link: http://iconnect007.uberflip.com/i/911509

Contents of this Issue

Navigation

Page 70 of 99

Minimizes solder beading High ECM performance under low standoff components High print transfer efficiency with low variation Excellent wetting Very low bridging, slump, and solder balling Indium10.1HF Halogen-Free, No-Clean, Pb-Free S O L D E R P A S T E Click our video for more: Contact our engineers today: techsupport@indium.com Learn more: www.indium.com/avoidthevoid/SMTUS ©2017 Indium Corporation Typical Voiding >40% Void Area Indium10.1HF <10% Void Area

Articles in this issue

Links on this page

Archives of this issue

view archives of SMT Magazine - SMT-Dec2017