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68 The PCB Design Magazine • December 2017 "SIITME is more than a just a conference. The Association for Promoting Electronics Technol- ogy, APTE, succeeded in bringing together eight top international professionals to give keynote talks including Klaus-Jurgen Wolter (Technische Universitat Dresden, Germany), Gheorghe Brezeanu (Politehnica University of Bucharest, Romania), Stefan Techau (ASM Assembly Sys - tems GmbH & Co KG), Frederic Kratz (National Institut of Applied Sciences INSA, Centre Val de Loire, France), Joseph Fjelstad (Verdant Elec- tronics, USA), Jose Sartori (OSRAM Opto Semi- conductors), Etienne Sicard (INSA Toulouse, France), Radu Sporea (Advanced T echnology Institute, University of Surrey, Guildford, UK), and many specialists from Continental Auto - motive, Tecnometal (Italy), ES Srl Electronic Solution (Italy), SEM Communication & GEST Labs SRL (Italy), Comtest, Miele Tehnica, NTT Data." To focus on the future, the first day of the event was dedicated to the Industrial Workshop "Advanced Interconnection and Disruptive Tech- nologies, Debate for the Future Sustainable Elec- tronics Packaging." This event was moderated by industr y representatives Cosmin Moisa, Con- tinental Automotive Romania; Stefan Techau; Paul Svasta, University Politehnica of Bucharest; and myself. Topics included the reliability chal- lenge for the electronic products, front-end as- sembly capability, managing PCB supplier chal- lenges, and CETTI's early steps in exploring Oc- cam technology were also discussed. The final two days were divided between keynote speeches, industrial sessions, plena- ry oral and poster sessions. The works judged IEEE'S ROMANIAN SIITME SHOW A SUCCESS Figure 3: Occam was one topic that generated a good deal of discussion. Figure 4: Gaudentiu Varzaru presenting CETTI's first trials in Occam technology. Figure 5: The exhibition took place in parallel with the conference. Figure 6: Discussions took place during the poster sessions.