PCB007 Magazine

PCB-Apr2018

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Contact us More information Low stress, Low CTE, Ultra-thin IC substrate materials ・Place: Sheraton San Diego Hotel & Marina ・Product: IC substrate materials, Encapsulation materials ・Poster session (at Northern Hemisphere Foyer) May 30, 2018 2:00-4:00 pm - Low Dielectric Properties Encapsulation for High Frequency Devices May 31, 2018 9:00-11:00 am - 3D Stacking Process with Thermo-Sonic bonding Using Non-Conductive film May 29 - June 1 ・ Decrease the warpage by low stress ・ Available to wide range of IC packages Features Laminate R-G525 Prepreg R-G520 Comparison of warpage in various IC Packages Our Booth # 708 -150 -100 -50 0 50 100 150 200 25℃ 260℃ R-G525 (E glass) 3ppm material (S glass) -150 -100 -50 0 50 100 150 200 25℃ 260℃ R-G525 (E glass) 2ppm material (S glass) -150 -100 -50 0 50 100 150 200 25℃ 260℃ R-G525 (E glass) 2ppm material (S glass) Warpage IC Packages Warpage (μm) Warpage (μm) Warpage (μm) Chip 150μm Substrate 260μm Chip 150μm Substrate 160μm Chip 100μm Substrate 160μm

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