SMT007 Magazine

Solder Fortification ® Preforms ©2018 Indium Corporation QFN Edge Connector Through-hole RF Shielding • Increase solder volume to strengthen solder joint • Improve shape and volume of fillet to ensure joints meet IPC specifications • Eliminate costly, time-consuming processes • Packaged in tape & reel to maximize pick rate Contact our engineers today: techsupport@indium.com Learn more: www.indium.com/SMTUF Contact us for the Solder Fortification ® Design Guide Click our video for more:

• Cover
• Featured Content — 5G: Testing the Future Impact
• Additional Content
• Column — 5G: Testing the Future Impact
• Short — Demo Shows How 5G Enables Real-Time Data Analyses and Adaptive Control of Production Processes
• Column — The Role of Bismuth (Bi) in Electronics, Part 4
• Short — Growing Rework Demand from Assemblies for 5G, Communications Systems
• Feature — 5G Requires a New Approach to Testing
• Short — Thermaltronics Discusses Smarter Robotic Soldering System
• MilAero Highlights
• Feature — Conversations with…Keysight: Challenges and Opportunities in Testing 5G
• Supply Line Highlights
• Feature — Conversation with…Asteelflash: DFT Strategy Needed for 5G Assembly
• Article — It's Time to Retire ROSE Testing
• Article — Modeling on SMT Line to Improve Throughput
• Column — Masking of Conformal Coating During Assembly and Rework
• EIN and Market Highlights
• Article — Enabling an Intelligent Supply Chain for Electronics Manufacturing
• Article — Elements to Consider on BGA Assembly Process Capability
• Short — Rehm Discusses How Vacuum Reflow Technology Helps Reduce Voiding
• Top 10 Recent Highlights from SMT007.com
• Career Opportunities
• Events Calendar
• Advertiser Index and Masthead
• Back Cover