SMT007 Magazine

SMT-May2018

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MAY 2018 I SMT007 MAGAZINE 81 5 5 Techniques Used to Detect Counterfeit Electronic Components E Although government pres- sure and private resources have helped minimize the risk of counterfeit compo- nents from entering the supply chain, there is still and will most likely continue to be, a prominent threat. So, what can you do to minimize this risk? Read on. 6 RTW IPC APEX EXPO: Zentech Discusses New NIST Legislation E Matt Turpin, president and CEO of EMS firm Zentech Manufacturing Inc., speaks about the NIST 800-171 legislation published by the National Institute of Stan- dards and Technology, and how it is different from other regulations such as ITAR. 7 Fabrinet Upgrades SMT Facility with Class 8 Clean Room E Fabrinet UK has upgraded its On-Demand facility to offer a Class 8 clean room. The unit, part of its high mix low volume manufacturing facility in the UK is already being widely used by customers across both A&D and Telecoms. 8 RTW IPC APEX EXPO: Miraco Company and Services Introduction E Miraco's current quality manager, William Pfings- ton, fills Guest Editor Steve Williams in on the company's contract manufacturing capa- bilities and services, includ- ing strengths in design and flex circuits. He also talks about the company's expansion and organizational changes. 9 Four Conferences for the First Time at electronica E The conferences in the context of electronica are getting new addi- tions this year. In addi- tion to the Automotive Conference, Embedded Platforms Conference and Wireless Congress, the Medical Electronics Conference, all dealing with developments and trends in electronics, will take place for the first time. J IPC Publishes Standard on Low-Pressure Molding for Circuitry Encapsulation E IPC announces a new standard, IPC-7621, Guideline for Design, Material Selection and General Application of Encapsulation of Elec- tronic Circuit Assembly by Low Pressure Mold- ing with Thermoplastics, a guidance document that offers instruction on using Low Pressure Molding (LPM) in place of potting for circuitry encapsulation. For the latest news and information, visit SMT007.com. Subscribe to our newsletters or premium content at my I-Connect007.

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