SMT007 Magazine

SMT-May2018

Issue link: https://iconnect007.uberflip.com/i/976095

Contents of this Issue

Navigation

Page 24 of 91

Solder Fortification ® Preforms ©2018 Indium Corporation QFN Edge Connector Through-hole RF Shielding • Increase solder volume to strengthen solder joint • Improve shape and volume of fillet to ensure joints meet IPC specifications • Eliminate costly, time-consuming processes • Packaged in tape & reel to maximize pick rate Contact our engineers today: techsupport@indium.com Learn more: www.indium.com/SMTUF Contact us for the Solder Fortification ® Design Guide Click our video for more:

Articles in this issue

Links on this page

Archives of this issue

view archives of SMT007 Magazine - SMT-May2018