SMT007 Magazine

SMT-May2018

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6 SMT007 MAGAZINE I MAY 2018 SHORTS: Demo Shows How 5G Enables Real- Time Data Analyses and Adaptive Control of Production Processes Growing Rework Demand from Assemblies for 5G, Communications Systems Thermaltronics Discusses Smarter Robotic Soldering System Rehm Discusses How Vacuum Reflow Technology Helps Reduce Voiding DEPARTMENTS: Career Opportunities Events Calendar Advertiser Index & Masthead ARTICLES: It's Time to Retire ROSE Testing by Joe Russeau and Mark Northrup Modeling an SMT Line to Improve Throughput by Gregory Vance and Todd Vick Enabling an Intelligent Supply Chain for Electronics Manufacturing by Thilo Sack, Alex Chen, James Huang, and Sam Khoo Elements to Consider on BGA Assembly Process Capability by Dora Yang COLUMNS: The Role of Bismuth (Bi) in Electronics, Part 4 by Dr. Jennie S. Hwang Masking of Conformal Coating During Assembly and Rework by Bob Wettermann HIGHLIGHTS: MilAero Supply Line Markets Top Ten from SMT007.com 36 42 62 74 12 54 22 30 60 80 11 15 20 78 84 90 91 MAY 2018 • ADDITIONAL CONTENT 42

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