SMT007 Magazine

SMT-Jun2018

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Solder Fortification ® Preforms ©2018 Indium Corporation QFN Edge Connector Through-hole RF Shielding • Increase solder volume to strengthen solder joint • Improve shape and volume of fillet to ensure joints meet IPC specifications • Eliminate costly, time-consuming processes • Packaged in tape & reel to maximize pick rate Contact our engineers today: techsupport@indium.com Learn more: www.indium.com/SMTUF Contact us for the Solder Fortification ® Design Guide Click our video for more:

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