PCB007 Magazine

PCB-Jun2018

Issue link: http://iconnect007.uberflip.com/i/992528

Contents of this Issue

Navigation

Page 34 of 95

autocatalytic 23% Topography of the Nickel after gold stripping: Ni µm/Pd 0.1µm/Au 0.1µm No excessive nickel at pin hole even at 100nm gold plating Aurotech G-Bond provides an ideal corrosion free for ENIG, ENEPIG and high capability, nickel free EPAG finishes at a deposition of >100nm. Aurotech G-Bond is an alternative to electrolytic gold. The thickness can be manipulated to ensure best wire bonding results. Plus no more yield decreasing bussing structures have to be designed into the process. The superior performance of Aurotech G-Bond is based on a gold concen- tration of 0.8 in the bath which is 50 % less than the marketed alternatives. Reliable bonding with next generation wires such as silver is also possible. (Data taken from EPAG). 0.8 g/l gold: ensures economic benefits Technology for tomorrow's solutions www.atotech.com Global head office Atotech Deutschland GmbH +49 (0)30 349850 info @ atotech.com Aurotech G-Bond Corrosion free thick electroless gold >100 nm gold for ENIG/ENEPIG/EPAG immersion 77%

Articles in this issue

Links on this page

Archives of this issue

view archives of PCB007 Magazine - PCB-Jun2018