Issue link: https://iconnect007.uberflip.com/i/992528
JUNE 2018 I PCB007 MAGAZINE 61 240°C or 260°C was applied for mounting the solder ball as shown in Figure 1. SJR was mea- sured by ball pull (BP) test as shown in Table 2. The cross-section image of the deposits was observed by FIB-SEM. Electroless Ni was plat- ed to protect Au deposit at the top surface be- fore FIB. And the cross-section image of inter- metallic compounds (IMC) after mounting the solder ball was observed by FE-SEM after pol- ishing by cross section polisher. WBR was evaluated by wire bonding and pull test as shown in Table 3. The condition of heat treatment for WBR was done for 16 hours at 175°C. The element analysis at the top surface for each deposit was measured by Auger elec- tron spectroscopy. The conditions of AES are shown in Table 4. Inverse pole figure (IPF) image of the cross- section for each deposit was observed using Figure 1: Reflow profiles. Table 2: Test conditions of ball pull (BP) test. Table 3: Test conditions of wire bonding.