Jack McCullen Passes Away

September 9, 2014
McCullen, known to friends and peers as Jack, demonstrated remarkable leadership as Chairman of the JC-14.1 Subcommittee for Reliability Test Methods for Packaged Devices, where he guided the work of the subcommittee during one of the most significant shifts in electronic manufacturing processes to occur in the last 50 years: the transition to lead-free solder.
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