Design007 Magazine

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• Design007 Magazine: Packaging Trends
• Featured Content — Packaging Trends
• Additional Content
• Column — The Whole Package
• Short — Amkor SmartPackage Speeds Accurate Design and Verification
• Feature — Chuck Bauer Discusses the Future of Packaging
• Feature — Standard PCB Component Families, Part 1
• Short — Quantum Chains in Graphene Nanoribbons
• Feature — PCB Design Challenges: A Package Designer's Perspective
• Short — Quick Memory
• Feature — BGA Fanout Routing Overview
• Short — New 3D-Printed Device Could Help Treat Spinal Cord Injuries
• PCB007 Highlights
• Column — It's a Material World
• Column — Transitioning from FR-4 to High-Frequency Materials, Revisited
• Short — Smart Homes Open New Approaches and Business Models for Healthcare Delivery
• Column — Testing Time for Resins
• Short — EMA Expands Library with Power Integrations EDA and MCAD Models
• MilAero007 Highlights
• Article — The Impact of PCB Dielectric Thickness on Signal Crosstalk
• Short — Free Webinar: Panelization with the Xpedition Flow
• Article — Moving From 28 Gbps NRZ to 56 Gbps Pam-4: Is it a Free Lunch?
• Short — Novel Approach to Coherent Control of a Three-Level Quantum System
• Top 10 Recent Highlights from Design007
• Career Opportunities Section
• Events Calendar
• Advertiser Index and Masthead
• I-Connect007 Subscriptions and contact info.