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4 DESIGN007 MAGAZINE I AUGUST 2018 Chuck Bauer Discusses the Future of Packaging by I-Connect007 Editorial Staff Standard PCB Component Families, Part 1 by Tom Hausherr PCB Design Challenges: A Package Designer's Perspective by Bill Acito BGA Fanout Routing Overview by Christian Keller Over the past 60 years, packages have continued to evolve, and shrink. The transistor outline "metal cans" of the 1950s would look out of place today. Some pack- ages are no bigger than the period at the end of this sentence, complete with their own "inhalation warn- ing." Now, more types of packages than ever before that can be mounted on today's PCBs. But package design is more complex than ever, too. Packaging Trends 10 18 28 34 AUGUST 2018 • FEATURED CONTENT 10 28 18

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