AUGUST 2018 I DESIGN007 MAGAZINE 71
5
Advanced Stackup Planning
with Impedance, Delay and
Loss Validation
E
A typical PCB design usually
starts with the material selec-
tion and stackup definition—
the stackup planning or design
exploration stage. How reliable
are the data provided by the
material vendors and PCB manufacturers? Can
we use these data to predict trace width and
spacing for the target trace impedance or to
calculate delays or evaluate the loss budget?
6
EMA Expands Library with
Power Integrations EDA and
MCAD Models
E
EMA Design Automation announced the avail-
ability of symbols, footprints, and 3D models
for all Power
Integrations components, which
anyone can access for free from ultralibrarian.
com, power.com, and digikey.com. "With this
new set of models, engineers can simply down
-
load the library components they need for their
P
ower
Integrations based designs," said Manny
Marcano, president and CEO of EMA.
7
Susy Webb: Training the New
Generation of Designers
E
In this conference call with
I-Connect007 Editors Happy
Holden and Patty Goldman, I
asked Susy to discuss the next
generation of PCB designers,
some of the trends she's see-
ing among new PCB design-
ers, and the need for designers to take charge
of their own design training, whether their
management agrees or not.
8
Irridian Invests in New Printed
Circuit Board Design Software
Suites
E
Recently acquired by Hindley Circuits, Irridian
Industrial Electronics, has invested in intro-
ducing state-of-the-art PCB design software to
significantly enhance the accuracy and speed
of its design services. The new Zuken CAD-
STAR and Altium design software platforms
have modern and interactive user interfaces.
9
Achieving Optimum Signal
Integrity During Layer Transition
on High-Speed PCBs
E
This article discusses the
impact of stitching vias and
discontinued return path or
reference on signal integ-
rity during layer transition
on high-speed PCBs, par-
ticularly in terms of signal
reflection and crosstalk.
J
Cadence Sigrity 2018 Release
Accelerates PCB Design Cycles
E
Cadence Design Systems
has launched Cadence Sig-
rity 2018, which includes
new 3D capabilities that
enable PCB design teams
to accelerate design cycles
while optimizing cost and
performance. A unique, 3D design and 3D
analysis environment integrating Sigrity tools
with Cadence Allegro technology provides a
more efficient and less error-prone solution
than current alternatives utilizing third-party
modeling tools.
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