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4 PCB007 MAGAZINE I SEPTEMBER 2018 PCBs are now approaching semiconductors with regard to feature sizes. Given this growing trend that shows no signs of slowing down, our experts this month ex- plain substrate-like PCBs (SLP) and the semi-additive processes (SAP) that will help the industry achieve the seemingly impossible (less than 25-micron) features that are coming our way! mSAP and SLP Additive Electronics: PCB Scale to IC Scale by Tara Dunn The Changing Shape of the HDI Market by Roger Massey Catching up with... James Rathburn, President, HSIO Technologies by Dan Beaulieu Smartphone Substrate-Like PCBs Will Revolutionize the IC Substrate and PCB Markets by Emilie Jolivet 12 18 34 44 SEPTEMBER 2018 • FEATURED CONTENT 18 34 12 44 12

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