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Cu wire PallaBond ® is an environmentally friendly process suitable for high frequency and fine L/S applications. The process provides very good bonding capability with aluminum-, gold-, silver-, copper- and copper-palladium-wires. Especially outstanding is its good solder joint reliability. Thanks to its very mild process conditions, it provides excellent compatibility with base materials and soldermasks. It also consumes less energy and water than ENIG, ENEPIG and immersion tin finishes. Bio compatible pure palladium ideal for medical application atotech.com Global head office Atotech Group +49 30 349850 info@atotech.com PallaBond ® IMC investigation 0.1 μm Pd / 0.1 μm Au Top view: copper-wire 20 μm on EPAG finish Direct pure EPAG for real fine L/S applica on Premium soldering and wire bonding capability

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