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48 PCB007 MAGAZINE I SEPTEMBER 2018 aging technology and has provoked changes in PCBs. It became more than an interconnection but part of the integration of the package. The advanced substrate activity at Yole will keep on investigating these trends and provide more analysis of this market. PCB007 Images All images from Yole Développement's re- port, "Status of Advanced Substrates: Embed- ded Dies & Interconnects, Substrate Like PCB Trends," February 2018. References 1. Status of Advanced Substrates 2018: Embedded Dies & Interconnects, Substrate-Like PCB Trends report, Yole Dével- oppement, February, 2018. Emilie Jolivet is director of the Semiconductor & Software Division at Yole Développement, part of Yole Group of Companies, where her specific interests cover package and assembly, semiconductor manufac- turing, memory, and software and computing fields. Figure 3: Advanced substrate market evolution. a stretchable electronic patch that can be worn on the skin like a bandage and used to wirelessly monitor a vari- ety of physical and electrical signals, from respiration, to body motion, to temperature, to eye movement, to heart and brain activity. "Our vision is to make 3D stretchable electronics that are as multifunctional and high-performing as today's rig- id electronics," said senior author Sheng Xu, a professor in the Department of NanoEngineering and the Center for Wearable Sensors, both at the UC San Diego Jacobs School of Engineering. (Source: UC San Diego) By stacking and connecting layers of stretchable cir- cuits on top of one another, engineers have developed an approach to build soft, pliable "3D stretchable electronics" that can pack a lot of functions while staying thin and small. As a proof of con- cept, a team led by the University of Califor- nia San Diego has built 'Building Up' Stretchable Electronics to be a Multipurpose Smartphone

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