PCB007 Magazine

B o o t h 5 1 2

• Cover
• Featured Content — mSAP and SLP
• Additional Content
• Column — SLP: The Next Level of Technology
• Short — Tags that Turn Everyday Objects into Smart, Connected Devices
• Feature — Additive Electronics: PCB Scale to IC Scale
• Feature — The Changing Shape of the HDI Market
• Short — The Electronic Transistor You've Been Waiting For
• Supplier Highlights
• Feature — Catching up with…James Rathburn, President, HSIO Technologies
• Feature — Smartphone Substrate-Like PCBs Will Revolutionize the IC Substrate and PCB Markets
• Short — 'Building Up' Stretchable Electronics to be a Multipurpose Smartphone
• Electronics Industry News and Market Highlights
• Column — Understanding Resist Lock-in and Extraneous Copper
• Article — Copper Pillar Plating Systems: High Speed, Low Heat
• MilAero007 Highlights
• Column — Global Sourcing: The 5 Cs of Choosing the Right PCB Supplier
• Short — Texas Engineers Work with Uber and Army Research Labs on uberAIR
• Column — Meet Nicolas Robin, IPC's New Senior Director in Europe
• Top 10 Recent Highlights from PCB007
• Career Opportunities Section
• Events Calendar
• Advertiser Index and Masthead
• I-Connect007 Subscription and Contact Information