OCTOBER 2018 I PCB007 MAGAZINE 115
5
Solder Mask: You've Come a
Long Way, Baby! E
I-Connect007's editing team
met with Electra Polymers'
Shaun Tibbals and Antony
Earl to discuss what's new
with solder mask, includ-
ing direct imaging and ink-
jet printing of solder mask,
and what PCB manufactur-
ers and OEMs need to know.
6
Circuit Automation on the
Ever-Evolving World of
Solder Mask E
In a recent conference call,
the I-Connect007 editorial
team was joined by Circuit
Automation's Yuki Kojima,
VP of engineering; Larry
Lindland, sales and appli-
cations manager; and Tom
Meeker, CEO, for a lively dis-
cussion about solder mask. Spoiler: it's not all
about the equipment.
7
Thermal Capabilities of Solder Masks:
How High Can We Go? E
This article focuses on three different coating
material groups that were formulated to oper-
ate under high thermal stress and are applied
at the printed circuit board manufacturing lev-
el. While used for principally different appli-
cations, these coatings have in common that
they can be key to a successful thermal man-
agement concept especially in e-mobility and
lighting applications.
8
Building a Better Board:
It Always Comes Back to
Communication E
For our experts meeting on
August's theme of reliabili-
ty, we reached out to Mark
Osborn, president and CEO
of Colonial Circuits, Kev-
in Knapp, quality manag-
er, and Rodney Krick, man-
ufacturing manager, and
asked them to participate in a conference call
with our I-Connect07 editorial team.
9
Autocatalytic Gold: How it Fits
as a Final Finish E
For process sequences or more
information regarding semi-
autocatalytic gold baths or the
latest in the development of a
fully autocatalytic gold bath
that can eliminate corrosion at
thickness of >100 nm, please
contact the author.
J
The IPC High-Reliability Forum
for Mil-Aero and Automotive
Sectors E
I-Connect007's Happy Hold-
en had the pleasure of at-
tendng the IPC's High Reli-
ability Forum (HRF) in Bal-
timore in May. As the IPC
scripted it, it was a "Tech-
nical Conference with a Focus on Electronics
Subjected to Harsh-Use Environments."
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