Issue link: https://iconnect007.uberflip.com/i/1038326
32 PCB007 MAGAZINE I OCTOBER 2018 Plating Capability In addition to the original Uniplate horizontal copper plating, GreenSource has added two hor- izontal Uniplate platers for copper via fill, the modified semi-additive process (mSAP) for blind vias and the THF2 for thicker panels. A new ver- tical copper plater from Ludy is in construction that features X, Y, and Z cathode agitation, all with unique insoluble anode eductors that use a liquid electrolyte from Atotech. Like the Uniplate horizontal plating systems, direct current (DC) power can be pulsed as well as side-to-side cur - rent controls. This unit is for blind vias (aspect ratio [AR]>3:1) and through-holes (AR>30:1). Table 7: Seventeen specific cost reduction actions (Lean) and their impact.