60 FLEX007 MAGAZINE I OCTOBER 2018
1
EPTE Newsletter: Thinner and
Lighter Printed Circuits E
Cutting-edge semiconductor manufacturers can
generate less than 10 nanometer traces on
silicon chips. Compared to integrated circuit
(IC) chips, the fine pattern capabilities from
PCB manufacturers are three orders lower
while flex circuit manufacturers are generating
patterns finer than 15 microns on polyimide
films using a reel-to-reel process.
2
Trouble in Your Tank:
Flexible Metalization, Part II E
The main concern about
electroless copper on
polyimide material is the
creation of a void caused
by peeling or blistering.
Often, fabricators resort to
double-passing the circuits
through the electroless
copper process hoping the
second pass will cover the void and prevent
further blistering.
3
Institute of Circuit Technology
Hayling Island Seminar E
After an extreme summer heat
wave had left trees dehydrated
and struggling to morph into
their customary display of
reds and golds, the leaves
were brown and brittle as the
great and good of the UK printed circuit board
industry crossed the bridge from the mainland
of the south coast of England to Hayling Island
for the autumn seminar of the Institute of
Circuit Technology on September 20, 2018.
4
Standard of Excellence: Working
for the Future—Partnering with PCB
Vendors on Innovative Technology E
The true test of the vendor-
customer relationship comes
when you need innovative PCBs
that are not easily found in the
marketplace and are so tech-
nologically advanced they require
your designers and suppliers to work together.
Mike Carano
Anaya Vardya
Mike Carano
Bill Wilkie
