SMT007 Magazine


Issue link:

Contents of this Issue


Page 53 of 101

54 SMT007 MAGAZINE I NOVEMBER 2018 Are Megatrends Putting Your Product at Megarisk? E It took 38 years for radio to get 50 million users, television made it in 13 years, Internet in four, iPod in three, and Facebook in only two years. What these numbers mean to our industry is the need to create electronics at blazing speeds that we haven't seen before. But how will it affect reliability? Read on. Electronic Components Market Update E Unfortunately, there is still no end in sight to the electronic component shortage, and some lead-times are being quoted with 2019 and even 2020 delivery dates! So if you are working with an EMS provider, it remains vital that you communicate and share forecast information with them. You may also want to start looking at the option of fitting, or designing in, smaller components to your PCB assemblies. Volunteers Honored for Contributions to IPC, Electronics Industry E IPC—Association Connecting Electronics Indus- tries presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on October 15 at IPC's Fall Standards Development Committee Meetings in Rosemont, Illinois. Tips to Improve Soldering Tip Life and Reduce Cost E Whether in production, or repair and rework, the cost of soldering iron tips can be easily overlooked, but with today's requirement for higher temperatures in lead-free solder applica- tions, the consumption of tips has dramatically increased. This fact, combined with changes in tip design to meet the higher thermal load requirements, has also resulted in escalating tip costs, making tip care a high priority. Indium on Voiding and Auto Electronics Test Standard E In this interview with I-Connect007, Indium Corporation Technical Manager Jonas Sjoberg discusses voiding and other key challenges in soldering, as well as an automotive electronics testing standard based out of South Korea that is seeing increased utilization all over Asia. He also talks about the increasing trend in manu- facturers moving to Type 5 and Type 6 solder powders, and how this is causing its own set of challenges in printing. IoT: Driving Change in Manufacturing E In the manufacturing world, the Internet of Things (IoT) can be seen as an element of Industry 4.0. The idea behind it is that factories would evolve to become smarter, to become a lot more flexible—to be able to make the prod- ucts that customers want, basically at any time that they need. XR Update: Emerging Realities E The rate of advance in the use of XR—the term now being used to cover AR (augmented real- ity), VR (virtual reality), and MR (mixed real- ity)—in many areas, along with advances in the hardware and network capability supporting the use of XR, is accelerating. And because things are moving so quickly, here's a quick review and an update on recent developments in this field. ESI's New Allegro LC Extends High-Volume Test Capability to Larger MLCCs E Electro Scientific Industries, Inc. has announced the availability of its new Allegro LC test system, designed to address the high- level testing of larger multilayer ceramic capac- itors (MLCCs) used increasingly in rapidly growing applications, including handheld, IoT and automotive products.

Articles in this issue

Links on this page

Archives of this issue

view archives of SMT007 Magazine - SMT007-Nov2018