Design007 Magazine

66 DESIGN007 MAGAZINE I NOVEMBER 2018 Figure 11: Impedance magnitude correlation of the 0.5-mil laminate data at the corner (L) and center (R). Figure 13: Impedance magnitude correlation of the 0.35-mil laminate data at the corner (L) and center (R). Figure 12: Capacitance extracted from the imaginary part of impedance of the 0.5-mil open-edge board data. Figure 14: Capacitance extracted from the imaginary part of impedance of the 0.35-mil open-edge board data.

• DESIGN007 Magazine - November 2018
• Featured Content — Designing for the Future of Medicine
• Additional Content
• Column — Medical Electronics: Vital Signs Are Good
• Short — Electronic Tattoos Add Power to Wearable Computing
• Feature Interview — In Medical PCB Design, Innovation Never Stops
• Short — Electronic Skin Points the Way North
• Feature Interview — Dock Brown on Succeeding at Failure Analysis
• Short — New Designer: The Best Advice I Have Been Given
• Feature Column — PCB Designers: What You Do Matters
• Feature Interview — New Grad Designs PCBs for Smart Baby Beds
• Feature Interview — Internet of Body: The Next Big Thing for Medical
• PCB007 Highlights
• Column — Chapter Roundup and CID+ Certification
• Column — 10 Fundamental Rules of High-speed PCB Design, Part 3
• Column — Embedding Components, Part 5: Alternative Termination Methodologies and Surface Plating Variations
• Column — Internal Trace Temperatures: More Complicated Than You Think
• MilAero007 Highlights
• Column — Measurement-to-simulation Correlation on Thin Laminate Test Boards
• Short — How Can We Design Electronic Devices That Don't Overheat?
• Column — Six Tips to Ensure Parts Fit on Your Board
• Column — Top Tips for Successful Potting
• Article — Effects of PCB Fiber Weave on High-Speed Signal Integrity
• Short — New Insulating State Found in Stretched Graphene
• Top 10 Editor Picks from PCBDesign007
• Career Opportunities Section
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• Advertiser Index and Masthead
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