60 SMT007 MAGAZINE I DECEMBER 2018
Are You Connected to Reliability? E
The need for communication between every
operator on the manufacturing floor can be a
critical difference between a reliable piece of
hardware and one that presents some level of
unexpected performance. This column high
-
lights a few things happening in the shop floor,
such as touch-up soldering and third shift issue,
not commonly communicated, which can cause
performance issues.
Process, Design, and Material Factors
for Voiding Control for Thermally
Demanding Applications
E
Solder voiding is a common phenomenon across
all semiconductor packaging and electronic
board assemblies. There are many factors that
influence void frequency and size. This article
focuses on several process, design and mate-
rials selection considerations which control or
potentially reduce voiding to meet industry and
end-market acceptance criteria.
Top 5 Things to Know When Moving from
Hand Assembly to Robotic Assembly
E
A lot of factors go into the decision to hand-
build or outsource circuit boards. When the
decision is to outsource, there are a few impor-
tant things to consider. Some things that work
fine when hand soldering may stand in the way
of quality, repeatability, and reliability when
machine assembling. Here are some of the
most important considerations when changing
from hand-build to outsourced.
Low-temperature Solder Paste Process
Advantages
E
This article examines the performance of two
low melting point SnBi alloys used in solder
paste when assembling BGA components with
SAC alloy spheres, and the advantages of a low-
temperature process over the regular SAC assem-
bly process. It will also evaluate solder paste
capability regarding the process and the perfor-
mance of a joint formed with a low melting point
alloy solder paste and SAC305 spheres, includ-
ing process advantages and material capabilities.
Alpha Assembly Solutions on Training,
Education, and Low-temperature
Soldering
E
In this interview, Jason Fullerton of Alpha
Assembly Solutions discusses the benefits and
challenges of low-temperature soldering. He also
highlights the biggest concerns he's currently
seeing in the industry, including young engi-
neers lacking hands-on manufacturing experi-
ence and training, voiding and head-in-pillow
issues, and low-temperature soldering demands.
MacDermid Performance Solutions to
Integrate Electronics Chemicals and
Assembly Materials Businesses
E
MacDermid Performance Solutions announced
that effective January 1, 2019, it will combine
its Alpha Assembly Solutions and MacDermid
Enthone Electronics Solutions business units
to form MacDermid Alpha Electronics Solu-
tions, a $1.2 billion electronics chemicals and
materials business, headquartered in Water-
bury, Connecticut, USA.
Aegis Software and CircuitByte
Form Partnership in Europe
E
Aegis Software announces that CircuitByte
(formerly Router Solutions GmbH) has part-
nered with Aegis, integrating their advanced
BOM ConnectorTM tool with Aegis' Factory-
Logix digital MES platform.
