Issue link: https://iconnect007.uberflip.com/i/1058015
58 SMT007 MAGAZINE I DECEMBER 2018 The keynote speaker is Alex Stepinski, VP of GreenSource Fabrication, who will discuss recent innovations that enabled the construc- tion of circuit production lines with the capa- bility for single-piece flow, autonomous work cells, and extreme traceability capabilities that can yield higher quality levels and short- er cycle times than ever before while eliminat- ing the traditional environmental footprint of a PCB manufacturer at the same time. Examples of these key innovations and how they relate to the future of the automotive industry supply chain will be presented. Additional presentations will include: • Alun Morgan, Ventec International Group ambassador, and Giorgio Favini, a founder of Elga Europe. Ventec and Elga are substrate and specialty chemical companies, respectively, both located in Europe and have developed materials specifically for automotive applications. • The Senior Global VP of MacDermid Alpha Electron- ics Solutions, Joe D'Ambrisi, along with Director of Market- ing Communications Don Cul- len will present their global out- look for specialty chemicals and materials in automotive elec- tronic packaging. • Larry Wilson III, the leader of Nexteer Automotive's Global Electronics Costing Team, will provide a cost history and fore- cast of automotive electronics by following the history of a particular motor vehicle. • CTO of MicoteK Labs China, Bob Neves, will present "PCB Reliability Testing for Auto- motive Electronics—The China Story." Neves is a member of the HoF Council and the IPC Board of Directors. • Randy Hierman, VP of OptimalPlus, will present "Striving for Zero DPPM." He is work- ing with Tier-1 automotive supplier Continen- tal in Guadalajara on this topic. • Gene Weiner, IPC Executive Forum pro- gram chair, had this to say: "As the automotive industry increasingly incorporates electronics into its manufacturing, this provides a unique opportunity for IPC and our members to par- ticipate in this continually evolving field. This forum provides us with a chance to hear from subject-matter experts about the many ways for the involvement of our industry in automo- tive electronics." According to IPC's VP of Solutions, Sanjay Huprikar, this forum at IPC APEX EXPO 2019 is a great follow-up to IPC's June Automotive Electronics Forum held in Nuremberg, as well as the September launch of a new Reliabili- ty Council in Frankfurt. "It directly supports IPC's efforts to engage heavily with the trans- portation vertical," said Huprikar. Early registration is highly recommended to ensure participation in this event as it could be limited to 100 delegates. Information and registration for the IPC Executive Forum on Advancing Automotive Electronics is available online at www.ipcapexexpo.org. Along with breakfast, lunch and the VIP networking din - ner are included, although the dinner is for IPC members only. Judging from past events, the networking alone is worth the registration price. SMT007 2018 IPC Automotive Electronics Reliability Forum attendees, L—R: David Bergman, Lars-Olof Wallin, and Sanjay Huprikar.