DECEMBER 2018 I SMT007 MAGAZINE 93
5
Process, Design and Material Factors
for Voiding Control for Thermally
Demanding Applications
E
Solder voiding is a common
phenomenon across all semi-
conductor packaging and
electronic board assemblies.
There are many factors that
influence void frequency and
size. This article focuses on
several process, design and materials selec-
tion considerations which control or poten-
tially reduce voiding to meet industry and end-
market acceptance criteria.
6
Top 5 Ways to Mitigate PCB
Component Availability Problems
E
The electronics design world is by now aware
that we're in a very serious period of compo-
nents shortages. Allocation and shortages hit
every few years, but this one seems to be the
worst in recent memory. It could be a prob-
lem until 2020 and the supply chain and world
of components manufactures will likely be a
different animal coming out of it. Here are five
things you can do to minimize the effects.
7
Pros and Cons of
Dual Sourcing
E
Now, more than ever, there's a need for respon-
sive and flexible supply chains. For OEMs, one
solution to mitigate the risk of supply chain
disruption is to maintain relationships with
more than one supplier through dual sourcing—
the practice of purchasing a chosen raw mate
-
rial, product, or service from two (or sometimes
multiple) sources. Here are its pros and cons.
8
Green Circuits' Joe O'Neil and
Joe Garcia on the Best Kept Secret
E
Joe O'Neil, CEO,
a n d J o e G a rc i a ,
VP of sales and
marketing, at Green
C i rc u i t s d i s c u s s
with I-Connect007
Managing Editor Nolan Johnson about recruit-
ing new employees, new training and certifica-
tion requirements, tariffs, and more.
9
Cirtronics Sponsors NH Social
Venture Innovation Challenge
E
Cirtronics, a socially
responsible contract
m a n u f a c t u r e r
located in Southern
New Hampshire,
will be a sponsor
of the annual New Hampshire Social Venture
Innovation Challenge (SVIC).
J
TT Electronics Opens Design
Center in Shenzhen
E
TT Electronics
has announced
the opening of
a n ew d e s i g n
centre in Shen-
zhen, China. The
site will provide
world class design and R&D capabilities to
support the company's anticipated growth
plans, working in partnership with the global
manufacturing centres of excellence to deliver
smarter solutions together.
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