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atotech.com Global head office Atotech Group +49 30 349850 info@atotech.com Printoganth ® T1 Printoganth ® T1 is a new horizontal electroless copper bath with an extra- ordinarily high throwing power into the blind micro vias (BMVs). Offering maximum process security with the minimum electroless copper deposit on the panel surface. In combination with its deposition rate of 0.11µm/min, this makes Printoganth ® T1 the ideal solution for advanced modified SAP (amSAP) technologies. When used in Atotechs Uniplate ® machines, Printoganth ® T1 offers best in class performance with a small equipment footprint. CN-free 10 µm EHT = 10.00 kV WD = 6.5 mm Signal A = AsB 348 nm 272 nm Horizontal high throw electroless copper for amSAP technology BMV dimensions: Opening 110, Depth 100 80% Throwing power into BMVs <15% Variation in deposition thickness calculated by 4σ/avg in a Uniplate LB line

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