Issue link: https://iconnect007.uberflip.com/i/1067105
86 SMT007 MAGAZINE I JANUARY 2019 tors, voltage easily flows between the two. When processing assemblies with a water- soluble flux, or when cleaning no-clean flux, there is a failsafe for removing the conductive residues. Processing with no-clean flux types does not allow for any excess of contamina - tion from any of the selected materials such as PCBs and components. One of the few things that can be controlled in an effort to reduce overall cleanliness and quality is the reflow process. Future Work With the myriad of different no-clean flux formulas, a larger study that includes more types is in order to determine the effect of thermal energy on different types of chemistry used as flux activators. SMT007 Eric Camden is a lead investigator at Foresite Inc. To read past columns or contact Camden, click here. Table 4: IC results for Group 4. Figure 10: SIR results for Group 4.