Issue link: https://iconnect007.uberflip.com/i/1083315
REAL TIME WITH... IPC APEX EXPO 2019 SHOW & TELL MAGAZINE I I-CONNECT007 33 was an open forum on Wednesday morning to explain it and update everyone on the prog- ress. We expected 60 to show up, but when over 120+ attended, we had to get more chairs because there was no place to stand. You can catch up by getting our first pub- lication titled IPC-WP-023, "IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance: Via Chain Continuity Reflow Test—The Hidden Reliability Threat." The afternoon was spent in a closed working meeting by dividing into subgroups to work on our FMEAs, test vehicles, and data collection. The group will meet again at the IPC High Reliabil- ity Conference in the spring in Baltimore, Maryland. If you're interested in joining this group, contact Chris Jorgensen, direc- tor of technical transfer at IPC. Thursday was the final day of the exhibition. The only sad note was that there were fewer PCB fabrication supplier booths. There is so much con- solidation that what was once four booths for MacDermid, Enthone, OMG, and Alpha is now one booth for the newly combined MacDermid Alpha Electronics Solu- tions. The same is true for past equipment and materials exhibitors now represented by larger marketing firms. However, the SMT side is larger and growing. Next year, we meet in San Diego again dur- ing the first week in February. I hope to see you there! S&T Figure 2: Camstar Suite.