Stanna-Q
®
is an engineered solution for the production of quad flat, no
lead components. Because Stanna-Q
®
is an electroless process, bussing
for electrolytic connection does not need to be engineered into the strip
or carrier.
The singulation process necessitates an optimized pretreatment and active
bath to ensure total flank coverage. The process is specifically developed
to cope with both dicing and punching singulation methods. Stanna-Q
®
is
guaranteed to produce three dimensional solder joints resulting in maximum
reliability in the field and yields in production.
Enables high tin
thickness over (in μm)
atotech.com Global head office
Atotech Group
+49 30 349850
info@atotech.com
Stanna-Q
®
Excellent 3D solder joints for
increased reliability
Enhancing corrosion resistance
Enhanced 3D
solder joint reliability
Immersion n for QFN produc on
1.4
