52 SMT007 MAGAZINE I APRIL 2019
Aculon on Technology Developments and
Partnership with Henkel
E
Aculon CEO Edward Hughes and Pete Star-
key discuss surface modification technolo-
gies based on nanochemistry. Of particular
interest to electronics technologists are recent
developments in waterproofing treatments for
assemblies, and how Aculon's strategic part-
nership with Henkel opens up new opportuni-
ties.
IPC's John Mitchell: Electronics Industry
Backs USMCA Coalition
E
Representing the views of more than 2,500
U.S. companies engaged in the global elec-
tronics industry, and their nearly one
million workers, IPC—Association Connect-
ing Electronics Industries, is joining the
new USMCA Coalition, which is being
launched in Washington by the U.S. Chamber
of Commerce.
MIRTEC Discusses Automation, CFX,
and Sales Success
E
MIRTEC President Brian D'Amico speaks with
Dan Beaulieu about automation, the Connected
Factory Exchange (CFX) standard, and their
banner year last year. He speaks about Indus-
try 4.0, automating the inspection process, and
collecting more data to help refine the manu-
facturing process.
iNEMI on Next-generation
Soldering
E
Grace O'Malley, VP of technical operations at
iNEMI, and Nolan Johnson discuss the next-
generation soldering buzz session workshop
hosted by iNEMI at IPC APEX EXPO 2019 and
the upcoming bi-annual technology roadmap
that will be released this spring.
Thermaltronics Discusses
New Soldering Robot
E
Michael Gouldsmith, director of Thermaltron-
ics, speaks with Dan Feinberg about their new
TMT-9800S robotic soldering unit, and about
an inline robotic soldering system—the next
stage of their product development—sched-
uled to be released in the middle of the year.
Indium Launches Die-Level Bonding
Solder Composite
E
Indium Corp. has launched InFORMS ESM02,
a reinforced matrixed solder composite specifi-
cally designed to produce consistent bondline
thickness for die-level attach applications.
Zero Defects International Relocates to
Larger Facility
E
Zero Defects International is moving to a new
location with greater space to handle addi-
tional products and services. This facility is
also in Silicon Valley and is near the current
site on O'Toole Way in San Jose.
ASMPT Achieved Record Year in 2018
E
In 2018, ASMPT's SMT Solutions Segment did
exceptionally well, achieving new records in
billing, booking and segment profit consecu-
tively for the past two years. Revenue grew by
19.1% to $1.03 billion, contributing 41.1% to
the group's revenue.
Advanced 3D Solder Paste
Inspection Technology
E
Olivier Pirou, managing director of Vi TECHNOL-
OGY, provides Joe Fjelstad with an overview of
their advanced 3D solder paste inspection tech-
nology, featuring the ability to make corrections
in real time. And he talks about their efforts in
strengthening their inspection systems.
