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52 SMT007 MAGAZINE I APRIL 2019 Aculon on Technology Developments and Partnership with Henkel E Aculon CEO Edward Hughes and Pete Star- key discuss surface modification technolo- gies based on nanochemistry. Of particular interest to electronics technologists are recent developments in waterproofing treatments for assemblies, and how Aculon's strategic part- nership with Henkel opens up new opportuni- ties. IPC's John Mitchell: Electronics Industry Backs USMCA Coalition E Representing the views of more than 2,500 U.S. companies engaged in the global elec- tronics industry, and their nearly one million workers, IPC—Association Connect- ing Electronics Industries, is joining the new USMCA Coalition, which is being launched in Washington by the U.S. Chamber of Commerce. MIRTEC Discusses Automation, CFX, and Sales Success E MIRTEC President Brian D'Amico speaks with Dan Beaulieu about automation, the Connected Factory Exchange (CFX) standard, and their banner year last year. He speaks about Indus- try 4.0, automating the inspection process, and collecting more data to help refine the manu- facturing process. iNEMI on Next-generation Soldering E Grace O'Malley, VP of technical operations at iNEMI, and Nolan Johnson discuss the next- generation soldering buzz session workshop hosted by iNEMI at IPC APEX EXPO 2019 and the upcoming bi-annual technology roadmap that will be released this spring. Thermaltronics Discusses New Soldering Robot E Michael Gouldsmith, director of Thermaltron- ics, speaks with Dan Feinberg about their new TMT-9800S robotic soldering unit, and about an inline robotic soldering system—the next stage of their product development—sched- uled to be released in the middle of the year. Indium Launches Die-Level Bonding Solder Composite E Indium Corp. has launched InFORMS ESM02, a reinforced matrixed solder composite specifi- cally designed to produce consistent bondline thickness for die-level attach applications. Zero Defects International Relocates to Larger Facility E Zero Defects International is moving to a new location with greater space to handle addi- tional products and services. This facility is also in Silicon Valley and is near the current site on O'Toole Way in San Jose. ASMPT Achieved Record Year in 2018 E In 2018, ASMPT's SMT Solutions Segment did exceptionally well, achieving new records in billing, booking and segment profit consecu- tively for the past two years. Revenue grew by 19.1% to $1.03 billion, contributing 41.1% to the group's revenue. Advanced 3D Solder Paste Inspection Technology E Olivier Pirou, managing director of Vi TECHNOL- OGY, provides Joe Fjelstad with an overview of their advanced 3D solder paste inspection tech- nology, featuring the ability to make corrections in real time. And he talks about their efforts in strengthening their inspection systems.

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