Design007 Magazine
Design007-Apr2019
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https://iconnect007.uberflip.com/i/1101604
Contents of this Issue
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The Future of Design Data
Articles in this issue
Desig007 Magazine: April 2019
Featured Content — The Future of Design Data
Additional Content
Column — Get Smart!
Feature — Smart Design Data Is Essential for Industry 4.0 Manufacturing
Short — Tiny Silicon Nanoparticles Cement New Era for Ultra-high Capacity Batteries
Feature Column — Standards-driven, Digital Design Flow for Industry 4.0
Feature — Automation and the Smart Factory: Introduction to Industry 4.0
Short — Photonics Breakthrough: Device That Shakes Light
Feature — XNC Format: Gerber Takes Data Into the Future
Feature Interview — XPLM: Using PLM to Integrate ECAD and MCAD Data
PCB007 Highlights
Column — San Diego Chapter Updates and More
Column — Preparing for Tomorrow's Technology Today
Column — Five Tips to Further Improve Resin Encapsulant Performance
Short — Researchers Report Advances in Stretchable Rubbery Semiconductors, Integrated Electronics
Column — Fast and Accurate Transmission Line Modeling
Column — How Copper Properties Impact PCB RF and High-speed Digital Performance
MilAero007 Highlights
Article — EM Modeling: The Impact of Copper Ground Pour on Loss and Impedance
Short — New Graphene-based Device Paves the Way for Ultrasensitive Biosensors
Top 10 Editor Picks from PCBDesign007
Career Opportunities Section
Events Calendar
Advertiser Index and Masthead
Archives of this issue
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