72 DESIGN007 MAGAZINE I APRIL 2019
1
Todd Westerhoff Discusses His New
Position and Much More
E
A t D e s i g n C o n , A n d y
Shaughnessy met with our
old friend Todd Westerhoff.
Todd recently joined Mentor,
a Siemens Business, and dis-
cussed his new job respon-
sibilities, his drive to get
more designers and engineers to use SI tools,
and the increasing value of cost-reduced de-
sign techniques versus overdesigning PCBs.
2
Beyond Design: Not All PCB
Substrates Are Created Equal
E
PCB substrates are all around us in every gadget
we use. It is a carrier for the electronic devices
and the signal and power interconnects and is
usually planar in structure with conductors sepa
-
rated by insulating dielectric materials. However,
each product has a specific performance require-
ment and may need a distinct type of substrate
to comply with the product's specifications.
3
Embedding Components, Part 7—
Semiconductor Placement and
Termination Methodologies
E
Progress in developing high-density embed-
ded-component substrate capability has accel-
erated through the cooperation and joint de-
velopment programs between many govern-
ment and industry organizations and technical
universities.
4
The Digital Layout:
Cascade Designers Council Chapter
and 2019 Activities
E
Our CID+ class had four peo-
ple enrolled who came from
around the area. All who at-
tended learned about how
board materials affected their
designs, including EMI, EMC,
impedance control, power
distribution techniques, board stackups, and
placement strategies in more detail than what
was in the CID.
Editor Picks from PCBDesign007
Todd Westerhoff
Stephen Chavez
