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6 PCB007 MAGAZINE I APRIL 2019 SHORTS: Researchers Discover New Material to Help Power Electronics Creating Better Solar Cells George Fox University: Teaching PCB Design to EE Students Tiny Waveguides Could Enable Better Biomedical Devices, Wearable Displays Agfa on Revolutionary Inkjet Solder Mask Applications Atomic-scale Binary Logic Could Power Faster, More Energy-efficient Electronics DEPARTMENTS: Career Opportunities Events Calendar Advertiser Index & Masthead ARTICLES: Averatek on the Future of Additive and Semi-additive Processing Interview with Mike Vinson Electrolytic Plating: Filling Vias and Through-holes by Mustafa Özkök, Sven Lamprecht, Akif Özkök, Dolly Akingbohungbe, Moody Dreiza, and Alex Stepinski Vertical Conductive Structures, Part 1: Rethinking Sequential Lamination by Joan Tourné COLUMNS: Youth in the Industry— Reaching New Heights by Nolan Johnson OSP Performance: Effect of Film Thickness and Microetch by Michael Carano HIGHLIGHTS: PCB007 Suppliers EIN007 Industry News MilAero007 Top 10 from PCB007 70 74 88 8 84 44 62 68 94 29 32 34 54 87 93 97 106 107 APRIL 2019 • ADDITIONAL CONTENT 74

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