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82 PCB007 MAGAZINE I APRIL 2019 2. Capable of filling microvias with a size of 15x10 µm by having only 5 µm plated thickness on the surface and a dimple less than 2 µm (Figure 10) Furthermore, this new plating tool enables panel-level packaging technology on IC sub- strates. This allows the IC substrates industry to compete with the semiconductor wafer lev- el packaging technologies and plate new fea- tures, such as copper pillars. Summary This paper presents the actual status of mi- crovia filling and through-hole filling realized by electrolytic copper plating processes. The dimensions of microvias and through-holes that can be filled by electrolytic copper pro- cesses today were shown. Further, the cop- per-filling technologies versus paste plugging were compared and the benefits of the cop- per filling technologies have been illustrated. The scope of future developments in terms of microvia filling and through-hole filling have been addressed. Next-generation technology segments, such as panel level packaging (PLP) and plating of copper pillars on IC substrates realized by a novel electrolytic copper plating processes, were also considered. PCB007 References 1. Fraunhofer IZM website. 2. Würth Elektronik, chapter micro via filling. 3. Stack Exchange, chapter via-in- pad technology. 4. Sano, S. "Current state and future trends of PCBs in AVIO." Nether- lands: Fifth EMPPS workshop, Ch. 3.1, pp. 11–14, 2014. 5. Lamprecht, S. "Plating a ther- mal runaway in PCBs: Solid copper through via filling." IPC workshop, Ch. 3.1, pp. 11–14, 2018. Mustafa Özkök is the global product manager for panel and pattern plating and works in the Atotech office in Berlin. Sven Lamprecht is the director OEM/EMS technology exchange for Atotech. Dolly Akingbohungbe is a lead field service chemical process engineer for Atotech. Moody Dreiza is the business director for electronics, North America, Atotech. Alex Stepinski is the VP and officer of GreenSource Fabrication LLC. Akif Özkök is an inventor and patent holder for Atotech. Figure 10: Achieved copper thickness distribution on a 600x600-mm panel.