FLEX007

CIRCUITRY SOLUTIONS Metallization for Flex, Now perfected. BLISTER FREE ELECTROLESS COPPER Via Dep 4550 HIGH DUCTILITY ELECTROLYTIC COPPER MacuSpec VF-TH 200 The Perfect Combination www.macdermidalpha.com Ultra Low Stress Via Dep 4550 = No Blistering Traditional Electroless Copper Blisters on Polyimide and other Flex Substrate 85µm x 62µm TP min = 166%, knee 99% Fast Plating of Through Holes and Filling Vias in a Single Step

• FLEX007 Magazine Q2 2019 - April
• Featured Content — Concept to Completion
• Additional Content
• Column — From Start to Finish
• Short — 3D Printing Technology Enables Fabrication of Shape-conformable Batteries
• Feature — Leaning to Be More Flexible: Case Studies on Improving FPC Design
• Feature Interview — Collaboratively Creating Wearable Medical Products
• Feature — The GraftWorx Fluid Management Patch Story
• Video Short — Miraco Discusses Flexible Circuit Products and Offerings
• Feature Column — How to Get From Here to There
• Short — Wearable Devices Captures Cancer Cells from Blood
• Column — Alternative Constructions in Rigid-flex Designs
• Short — Electronic Textiles Research Develops Color-changing and Antibacterial Fabrics
• DuPont on New Beginnings and Empowering the Industry
• Short — Wearable Sensors Mimic Skin to Help With Wound Healing Process
• Interview — FlexFactor Program Informs, Inspires, Attracts, and Recruits Talent
• Flex007 News Highlights
• Article — Creating Smart Surfaces with Electronic Functionality
• Interview — Growing Opportunities with 3D Printed Electronics
• Top 10 Articles and Columns from Flex007.com
• Events Calendar
• Advertiser Index and Masthead