PCB007 Magazine


Issue link: https://iconnect007.uberflip.com/i/1116895

Contents of this Issue


Page 64 of 131

Stanna-Q ® is an engineered solution for the production of quad flat, no lead components. Because Stanna-Q ® is an electroless process, bussing for electrolytic connection does not need to be engineered into the strip or carrier. The singulation process necessitates an optimized pretreatment and active bath to ensure total flank coverage. The process is specifically developed to cope with both dicing and punching singulation methods. Stanna-Q ® is guaranteed to produce three dimensional solder joints resulting in maximum reliability in the field and yields in production. Enables high tin thickness over (in μm) atotech.com Global head office Atotech Group +49 30 349850 info@atotech.com Stanna-Q ® Excellent 3D solder joints for increased reliability Enhancing corrosion resistance Enhanced 3D solder joint reliability Immersion n for QFN produc on 1.4

Articles in this issue

Links on this page

Archives of this issue

view archives of PCB007 Magazine - PCB007-May2019