108 PCB007 MAGAZINE I JULY 2019
Coming Soon to PCB007 Magazine:
SEPTEMBER: Standards
We report on recent developments in current and
emerging standards and take a step back to discuss
some of the inherent strengths and weaknesses of
standards processes.
AUGUST: Wet Processes
Wet processes are the core of printed circuit fabrication.
What's new? Are there new offerings down the road to
make your wet process capabilities sharper? Faster?
Greener? Easier to operate? Find out in this issue.
Events Calendar
Additional Event Calendars
NEPCON South China 2019
E
August 28–30, 2019
Shenzhen, China
C3Bio Conference on Biosensors,
Bioelectronics, and Biodevices
E
September 9–10, 2019
Bath, U.K.
C3Bio Training Workshop on Lab-on-Chip
E
September 11–12, 2019
Bath, U.K.
EIPC PCB Pavilion @ WNIE Exhibition
E
September 18–19, 2019
Warwickshire, U.K.
productronica India 2019
E
September 25–27, 2019
Delhi NCR, India
electronica India 2019
E
September 25–27, 2019
Delhi NCR, India
52
nd
International Symposium on
Microelectronics
E
September 29–October 3, 2019
Boston, Massachusetts, USA
IPC Electronics Materials Forum
E
November 5–7, 2019
Minneapolis, Minnesota, USA
productronica 2019
E
November 12–15, 2019
Munich, Germany
2019 International Electronics Circuit
Exhibition (Shenzhen)
E
December 4–6, 2019
Shenzhen, China
