Issue link: https://iconnect007.uberflip.com/i/1156271
14 PCB007 MAGAZINE I AUGUST 2019 and guesswork. The first test was completed using chemistry designed for reverse pulse plat- ing even though we intended to run a completely DC cycle. How much difference the chemistry makes is difficult to quantify based on a single test, so it was only much later when a test was completed using a conventional DC plating solution that we re- alised there were some potential benefits to using the chemistry from our first test. Conclusion The aforementioned cases provide examples of some of the developments that I have seen adopted in recent new plating lines. However, there are a num- ber of other very developments that I cannot write about. Non- disclosure agreements apply to the most special of the plating processes and machines. When companies solve the toughest of problems, they are typically very reluctant to give away the key secrets involved, and with it, any possible technical advan- tage they have gained against their competition. As a supplier of plating equip- ment, one of the pleasures of my job is that I am able to work with some of the best engineers in the indus- try doing some truly interesting things—but I am sorry that I can't share more of it with you. PCB007 Marc Ladle is a director at Viking Test Ltd. To read past columns or contact Ladle, click here. Plating chemistry is also an area that is pre- senting an opportunity for some new devel- opments. Some of the most interesting results have come from being forced into a corner by the "only line in the factory" scenario. When you try something new, you pretty much have to design the experiment based on the copper solution in your plating tank. I watched a test using a pulse plating solution for very low area button plating test (just very few round pads being plated on an otherwise blank panel). The interesting aspect of the test is how good the results were based on simple calculations Figure 4: Top and bottom VCP clamps.